patent · US6478936
Anode assembly for plating and planarizing a conductive layer
12 November 2002
Indexed reference — no copy held
This patent is cited by material in the archive, so it is indexed here by number, title and inventor. The archive holds no copy of its text.
Abstract
A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad whi...
Provenance
- Collection
- Cited prior art
- Original PDF
- patentimages.storage.googleapis.com →
- Filed
- 2000-05-11
- Source
- Google Patents bibliographic record
- Granted
- 2002-11-12
- Inventors
- Rimma Volodarsky; Konstantin Volodarsky; Cyprian Uzoh; Homayoun Talieh; Douglas W. Young; ASM Nutool Inc