patent · US20170125268A1
Wafer debonding using mid-wavelength infrared radiation ablation
4 May 2017
Indexed reference — no copy held
This patent is cited by material in the archive, so it is indexed here by number, title and inventor. The archive holds no copy of its text.
Provenance
- Collection
- Patents citing this work
- Patent office record
- patents.google.com →
- Source
- Google Patents citing-documents table
- Assignee
- International Business Machines Corporation
- Published
- 2017-05-04