patent · US7074714B2
Method of depositing a metal seed layer on semiconductor substrates
11 July 2006
Indexed reference — no copy held
This patent is cited by material in the archive, so it is indexed here by number, title and inventor. The archive holds no copy of its text.
Provenance
- Collection
- Patents citing this work
- Patent office record
- patents.google.com →
- Source
- Google Patents citing-documents table
- Assignee
- Applied Materials, Inc.
- Published
- 2006-07-11