patent · US6492280B1
Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls
10 December 2002
Indexed reference — no copy held
This patent is cited by material in the archive, so it is indexed here by number, title and inventor. The archive holds no copy of its text.
Provenance
- Collection
- Patents citing this work
- Patent office record
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- Source
- Google Patents citing-documents table
- Assignee
- Tegal Corporation
- Published
- 2002-12-10